The all-new, Power-based microprocessor will pack some of IBM's most advanced technology into an energy-saving silicon package that will power Nintendo's brand new entertainment experience for consumers worldwide. IBM's unique embedded DRAM, for example, is capable of feeding the multi-core processor large chunks of data to make for a smooth entertainment experience.
IBM plans to produce millions of chips for Nintendo featuring IBM Silicon on Insulator (SOI) technology at 45 nanometers (45 billionths of a meter). The custom-designed chips will be made at IBM's state-of-the-art 300mm semiconductor development and manufacturing facility in East Fishkill, N.Y.
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IBM Microprocessors to Power the New Wii U System from Nintendo
